Tetrafluoromethane is primarily used in dry etching and plasma etching processes in semiconductor manufacturing. Under plasma, tetrafluoromethane forms active fluorine-containing particles that react with materials such as silicon and silicon dioxide, achieving selective removal from material surfaces. This gas exhibits high stability and excellent etching performance, making it widely used in integrated circuit and microelectronics manufacturing processes.

In the photovoltaic industry, tetrafluoromethane can be used in silicon wafer processing and related equipment cleaning processes. Through plasma reaction, residues on equipment cavities and material surfaces can be removed, improving the cleanliness of production equipment and process stability. As the processing precision of photovoltaic products continues to increase, stricter requirements are being placed on the purity, moisture content, and impurity content of process gases.

Tetrafluoromethane is also used in the production of display panels and electronic components, for processes such as thin-film etching and cavity cleaning. In actual production, tetrafluoromethane is often used in combination with other process gases depending on the materials and equipment conditions to obtain suitable etching rates and processing effects. For high-end electronic manufacturing processes, gas purity and supply stability are crucial factors affecting the effectiveness of its application.

Tetrafluoromethane can also be used in some specialized industrial and scientific research fields. Due to its stable chemical properties and good insulation performance, it has certain application value in specific processes. However, tetrafluoromethane is a gas with high global warming potential, requiring strengthened tail gas treatment and emission management during its production and use. With increasingly stringent environmental protection requirements, related industries are paying more and more attention to the recovery and utilization of process gases and emission reduction technologies.